DIP mounting machine has high efficiency, high precision, high degree of automation and other characteristics, in the electronics manufacturing industry is widely used. Here we will learn more about the working principle of DIP mounting machine.Smt Accessories
First, the basic structure of the DIP mounting machine
DIP bonder is mainly composed of four parts: feeding system, material selection system, laminating system and discharge system. The feeding system is mainly to remove the components from the material tray; the selection system is to rotate the components, optional and other processing, so that they can be correctly pasted onto the circuit board; the laminating system is to accurately paste the components onto the circuit board; the discharging system is to complete the laminating of the circuit board from the DIP mounter to remove.DIP Mounter
1.Component feeding
In the DIP mounting machine feeding system, there will be one or more material tray. Before starting work, the staff will be equipped with components into the feed system, and the DIP mounter in the middle of the "change plate pressure plate" put low.
The power is then switched on and the machine is started. After the machine starts working, the "change plate platen" will be raised and the components will be taken out from the tray and sent to the next operation through the conveyor belt.
2.Component selection
In the DIP mounter's material selection system, components are rotated and optionally processed so that they can be correctly attached to the board.
First, the components are sent through the conveyor belt to the inspection area, and the DIP mounter will detect the direction, size and shape of the components through photoelectric detection equipment to ensure that the components can be accurately pasted onto the circuit board.
Then, in the DIP mounter's material selection system, the components are correctly arranged so that they can be pasted onto the corresponding position on the circuit board.
3.Components lamination
In the laminating system of the DIP mounter, there will be some laminating heads, which have a suction function on them. When the components are sent to the laminating head, the laminating head will stick it to its own surface and then align it to the corresponding position on the circuit board for precise lamination.
4.Board discharging
In the DIP mounting machine's discharge system, the completed laminated circuit boards will be taken out of the DIP mounting machine's discharge port. These circuit boards are the circuit boards that have been completed DIP placement, can be used to do a variety of electronic products.
Third, the maintenance of DIP mounting machine
In the process of using DIP mounter, to ensure its normal work, need to carry out some maintenance work, as follows:
1, regularly check the parameters of the equipment, such as the normal operation of the conveyor belt, adsorption head adsorption effect.
2, timely replacement of worn parts of the equipment, such as conveyor belt, adsorption head, etc..
3.Frequent cleaning and hygiene of the equipment. In particular, clean the cam parts, the surface of the adsorption head, as well as the falling airflow pipe and the base, so as not to obstruct the entry and exit of raw materials and affect the efficiency of the equipment.
4, in the cleaning equipment, should pay attention to turn off the power to ensure personal safety.
The above is the working principle of DIP mounter and its maintenance content, we can study these contents carefully to further deepen the understanding and knowledge of DIP mounter and improve our operating skills when using DIP mounter.